- Die bonding - soldering
- Die bonding - gluing
- Active microlens alignment
- Burn-in micromodules/TO
- Testing micromodules
- Ball bonding
- Wedge bonding
- Cap welding
- Testing TO/OSA
- Component alignment
News & Events|
Argotechis a private company located in Trutnov in northeastern part of the Czech Republic in Europe.
The company was founded in 2006 based on existing tradition for microelectronic available in the region after the restructurization of Siemens and later on also of Infineon (more in History section).
Argotech is focused on providing of manufacturing, engineering and development services for microelectronic.
There is available an unique technology chain from wafer level packaging via TO packaging to optical subassembly or customized applications (more in Services or Technology in Menu Bar above).
Argotech is certified by ISO9001:2008.
© 2006 - 2016 Argotech. All Rights Reserved.